ASUS recently unveiled the third generation of its flagship acrobat camera, the Zenfone 8 Flip. The novelty corresponds to the spirit of the times, which means it is built on the Snapdragon 888, which has certain issues in terms of heat dissipation.
How ASUS has handled this issue?
An early disassembly from PBK specialists will tell about this. A careful study demonstrated several levels of heat dissipation: a graphite film between the glass and the motherboard, a copper plate directly on top of the chip, two layers of thermal paste on either side of the copper inter-layer.
All this is complemented by another copper tube that goes under the battery. Tests will show whether this complex system copes with its task.