Huawei Kirin 985 Mass Production: According to Taiwan media reports, some supply chain sources revealed that Huawei will begin mass production of Kirin 985 chips in the third quarter of 2019. So maybe there is really no Kirin 990 this year.
The Kirin 985 will use TSMC’s 7nm EUV process, and the package will use the Flip-Chip Package-on-Package (FC-PoP) process. The Huawei Mate30 series will be launched and may be equipped with a 5G baseband.
Compared to traditional processes, EUV (Extreme UV Lithography) allows the position of the transistor to be more accurate, while the transistor density on the chip can be increased by 20%, making the chip performance per unit area more powerful and lower energy consumption.
After the Kirin 985 uses the EUV process, the collective tube density will further increase and the performance will be further improved. Moreover, the production time of Kirin 985 chip coincides with Huawei’s annual flagship Mate 30 series, which makes the Mate 30 series more likely to launch the Kirin 985.
It is understood that Huawei Haisi has repeatedly considered striving to adopt TSMC’s advanced process with advanced packaging such as integrated fan-out package (InFO) one-stop service mode to compete with Apple’s A13 processor in performance.
As a result, Huawei’s sound volume in the chip market will be further enhanced, and the development of products and brands will be smoother.