TSMC officially announced the 6nm process! 7nm enhanced version also has extreme ultraviolet lithography.
In the past few years, Intel, which has been implementing the industry, has been slow in new processes, and the 10nm process has been slow to mass production. A key reason is that it has high requirements for technical indicators and is difficult to put into production.
On the other hand, TSMC and Samsung have made great progress. In addition to technological breakthroughs, they have adopted more flexible tactics, reduced the difficulty of new technology, and made a new version every time they were slightly improved.
For example, TSMC’s 16nm is an important node, and 12nm is upgraded and optimized based on it. Samsung is even more chaotic, except for the 14nm, 10nm, 7nm, 5nm upgrades, there are a series of transitional versions such as 11nm, 8nm, 6nm, 4nm.
Recently, TSMC announced that the 5nm EUV process has begun trial production. Compared with 7nm, the core area can be reduced by 45% and the performance can be increased by 15%.
At the same time, the Samsung 5nm EUV process has been designed to reduce power consumption by 20% compared with 7nm. Performance increased by 10%.
There are two versions of TSMC’s 7nm process. The first generation uses traditional DUV lithography. The second generation is the first to join EUV EUV lithography. It has entered the trial production stage. It is expected that the next generation of Apple A and Huawei Unicorn will be used.
The new 6nm process also has EUV EUV lithography, which claims to increase transistor density by 18% compared to the first 7nm process, while the design rules are fully compatible with the first generation 7nm, facilitating upgrade migration and lowering costs.
TSMC’s 6nm is expected to be trial production in the first quarter of 2020, suitable for mid- to high-end mobile chips, consumer applications, AI, network, 5G, high-performance computing.